EVENT

INTERMOLD 2016

OSG Corporation participated at the INTERMOLD 2016 from April 20-23 at the Intex Osaka in Osaka, Japan. As its name suggests, the exhibition showcased products used in die / mold and metal stamping related industries. According to the INTERMOLD Development Association, approximately 47,756 visitors participated at the 4-day event.

At the exhibition OSG introduced a number of new milling solutions, such as the Phoenix indexable series PSTW and PXMC, as well as expanded offering from its thread mill series. A special seminar on “IDEA OSG 1 and the threats of space debris” was also held during the exhibition featuring Mr. Yasunori Yamazaki from Astroscale.